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Semiconductor lasers are increasingly used in the engraving and cutting industry. Semiconductor lasers have the advantages of high energy density, high precision, high efficiency, and non-contact processing, and have become an important tool in the modern engraving and cutting industry.
Previously, the most common semiconductor lasers on the market were 450nm 1.6W and 5W blue lasers. With the development of the market economy, more and more users are pursuing high power, high precision, and finer laser engraving marks. The highest power of the blue laser diode on the market is 5W, and it is a multi-mode beam diode. The multi-mode beam has the disadvantage that the large focal dot can easily lead to uneven thickness of laser engraving marks. Based on customer needs, we have developed a solution that uses lenses or fiber optic modules to compress the rectangular beam into a square beam, making the laser dot smaller after focusing, the energy more concentrated, the engraving and cutting traces thinner, and the focus dot beam size is only 0.08mm.
Then, in order to increase the power and improve cutting and engraving capabilities, we developed a solution that combines multiple diode spots and outputs them from the same optical path, which solves the customer's high-power needs. We have successively developed blue laser modules with 10W, 15W, 20W, 30W and 40W output power. On this basis, we have continuously optimized the process, reduced processing costs, and improved cutting speed and cutting capabilities.
LDI (Laser Direct Imaging) technology is a modern PCB (Printed Circuit Board) manufacturing process that uses laser beams to directly draw circuit patterns, replacing traditional photolithography technology.
In short, semiconductor lasers play an important role in the LDI industry. They provide efficient and high-precision laser light sources and realize the modernization and automation of PCB manufacturing processes. With the development and application expansion of LDI technology, the application prospects of semiconductor lasers will become increasingly broad.
The application of semiconductor lasers in the LDI industry is mainly reflected in the following aspects:
Why Choose Us
  • Light Source
    As the main light source of LDI equipment, semiconductor lasers have the characteristics of high power, high efficiency, and long life. It can provide a stable laser beam to ensure the accuracy and quality of pattern drawing on PCB.
  • Laser Head
    The laser head in LDI equipment uses the beam of a semiconductor laser to directly draw circuit patterns. The laser head has a high-precision positioning system that can achieve micron-level precise drawing, making the PCB manufacturing process more refined and controllable.
  • High-speed Imaging
    The high-frequency modulation characteristics of semiconductor lasers enable LDI equipment to achieve high-speed imaging, greatly improving manufacturing efficiency. The laser's fast switching speed and high-frequency modulation capability enable LDI equipment to achieve rapid scanning and pattern drawing, greatly shortening the manufacturing cycle.
  • Multi-wavelength Selection
    Semiconductor lasers can change the luminous wavelength by adjusting the operating current or temperature to meet the needs of different materials. In the LDI industry, different PCB materials and processes require different laser wavelengths, and the multi-wavelength selection of semiconductor lasers can meet different application needs.
Lasers are widely used in the non-contact detection industry, which can improve the speed, accuracy and efficiency of detection, and can also be applied to various materials and environments.
Semiconductor lasers are widely used in the non-contact detection industry, including the following aspects:
Distance measurement: 
The laser can measure the distance between the target object and the laser source by measuring the propagation time or phase difference of light. This non-contact measurement method can be applied in various fields, such as industrial automation, building measurement, robot navigation, etc.
Surface defect detection:
 The laser can detect surface defects, depressions or blemishes by scanning the surface of the target object. This method is very common in quality control and product testing and can be applied to the detection of various materials such as metals, plastics, and glass.
3D reconstruction:
The laser can scan the surface of the target object to obtain the three-dimensional point cloud data of its surface. By processing these data, a three-dimensional model of the target object can be reconstructed. This method is widely used in industrial design, cultural relics protection, medicine and other fields.
Temperature measurement: 
The laser can indirectly measure the temperature of an object by measuring the radiated heat on the surface of the object. This method is often used in industrial production to measure high-temperature objects, such as furnaces, furnace temperature control, etc.
Color identification: 
The laser can identify the color of an object by measuring the spectral characteristics reflected by the object's surface. This method is widely used in automated production lines for object classification, sorting, etc.

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